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ABF Package Substrate/

CPCORE processes features of both multilayer ceramic technology and multilayer organic technology, and complies with 175µm via pitch routing and all layer stacked via. CPCORE material is flexible in routing design, which contributes to the enhancement of electrical performance. CPCORE is suitable for semiconductor packages where high speed signal transmission is required.
 
CPCORE Structure

CPCORE Structure

 

Features

  • Thermosetting PPE (polyphenyl ether) implemented; enhancing high frequency characteristics
  • 175µm BGA pad pitch enables full area array. Stacked via for all layers
  • Ideal micro strip structure available
  • Full layers stacked via and high density pad pitch facilitate high frequency design

 

Specifications

ItemSpecificationNote
Layer Structure3 to 25 
Line Width / Space30μm / 30μm 
Via Hole / Land Diameter100μm / 170μm*Standard Rule
 85μm / 145μm*Advanced Rule
Flip Chip Pad Pitch175μm 
Via Pitch175μm

About the IC Substrates. FC-BGA substrates. SHDBU substrates. FC-CSP Substrates. CPCORE Substrates. Module Substates. MSD substrates, FR substrates, SEN substrates , MIC substrates design and Fabrication questions. please contact with  info@alcantapcb.com 

 

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