Rogers PCB Manufacturing

rogers-pcb-Manufacturing

Rogers PCB Manufacturing. Rogers 3000 Series materials PCB fabrication, Rogers 4000 Series PCB manufacturing, Rogers Series printed circuit board fabrication. We also offer Rogers Hybrids & Mixed Dielectrics circuit board. Buried and Blind Vias holes boards. We have many Rogers series materials in stock and we can arrange to manufacture circuit boards at any time.

RO3000 Series laminates are circuit materials with consistent mechanical properties, regardless of the dielectric constant (Dk) selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering war-page or reliability problems. Additionally, the RO3000 series’ dielectric constant is stable over a wide temperature range.

Benefits

• Lowest loss commercial laminates
• Available in a wide range of Dk (3.0 to 10.2)
• Available both with and without woven glass reinforcements
• Low Z-axis CTE provides plated through-hole reliability

RO3003™ Laminates 

• Dk of 3.00 +/- 0.04
• Dissipation factor of 0.0013 at 10 GHz
• Available with Rolled Copper

RO3003G2™ Laminates 

• Next generation laminates for 77/79 GHz auto radar designs
• Very low profile ED copper for lower insertion loss
• Formulated to minimize Dk variation & enable micro vias

RO3006™ Laminates 

• Dk of 6.15 +/- 0.15
• Higher Dk allows for reduced circuit size

RO3010™ Laminates 

• Dk of 10.2 +/- 0.30
• Higher Dk allows for reduced circuit size

RO3035™ Laminates 

• Dk of 3.50 (+/-0.05)
• Dissipation factor of 0.0017 at 10 GHz
• Available with Rolled Copper

RO3210™ Laminates 

• Dk of 10.2
• Available with Rolled Copper
• Woven glass reinforcement increases laminate rigidity

Rogers RO4000 hydrocarbon ceramic laminates and prepregs are the industry leader. Used in microwave and millimeter wave frequencies, this low loss material offers easier use in circuit fabrication and streamlined properties over traditional PTFE materials.

Benefits

• Compatible with FR-4 fabrication processes
• Well controlled dielectric constants (Dk)
• Above-average thermal conductivity (.6-.8)
• Thermally robust – lead free soldering compatibility
• Low Z-axis CTE for reliable plated through-hole quality
• Optimized cost and RF/ microwave performance
• Wide range of DK available (2.55-6.15)
• UL 94 V-0 flame retardant versions available

RO4000® LoPro® Laminates 

• Allows reverse treated foil to bond to standard RO4000® dielectric
• Low DK loss for higher operating frequency designs
• Reduced passive intermodulation (PIM) performance

RO4003C™ Laminates 

• Original RO4000® material, used in cost sensitive Microwave/RF designs
• Dk of 3.38 (+/-0.05)
• Dissipating factor of 0.0027 at 10 GHz is lowest dielectric loss of R04000® product family

RO4350B™ Laminates 

• Market leading material for base station power amplifier designs
• UL 94 V-0 rated
• Dk of 3.48 (+/-0.05)
• Df 0.0037 at 10 GHz

RO4360G2™ Laminates 

• RoHS certified
• Low Z-axis CTE
• Dk 6.15 (+/- 0.015)
• Dissipating factor of 0.0038 at 10 GHz

RO4400™/RO4400T™ Series Bondply 

• Prepreg family based on RO4000 series core materials.
• Sequential lamination capable
• Lead free soldering capable
• Thinner options for improved multilayer design flexibility

RO4500™ Laminates 

• Commercial antenna grade series for high volume designs
• Excellent mechanical rigidity for efficient and reliable installation
• Improved PIM when used with LoPro™ copper

RO4700™ Antenna Grade Laminates 

• First RO4000® low Dk antenna grade material available
• Dk 2.55 (+/- 0.05) or 3.0 (+/- 0.05)
• Df 0.0022 at 2.5 GHz or 0.0023 at 2.5 GHz, respectively

RO4830™ Laminates 

• Low cost solution for millimeter wave patch antenna designs
• Insertion loss similar to RO3003™ laminate with standard ED copper at 77GHz
• Spread glass to minimize Dk variation

RO4835™ Laminates 

• 10x oxidation resistance compared to traditional thermoset laminates
• Dk 3.48(+/-0.05)
• Df 0.0037 at 10GHz

RO4835T™ Laminates 

• Thin offerings of the RO4835™ Laminates
• Spread glass minimizes Dk variation

CU4000™ and CU4000 LoPro® Foil 

• IPC-4562A Grade 3, High Temperature Elongation Foil
• Enables foil lamination of RO4000 Multilayer PCB
• Simplifies Multilayer PCB registration

If you have any questions, please feel free to contact us with info@alcantapcb.com , we will be happy to help you.