Rogers Cavity PCB manufacturing
Rogers Cavity PCB manufacturing. Open cavity Rogers PCBs. or buried cavity in the PCBs. Professional CAVITY PCB supplier. we offer the cavity PCB or buried cavity cavity PCB from 4 레이어 30 레이어.
Blind Vias&Buried Vias PCB manufacturing
Blind Vias&Buried Vias PCB manufacturing. Super small spacing, super small via holes HDI PCBs. we offer high quality Blind Vias&Buried Vias from 4 레이어 50 레이어. fast shipping time. and high quality.
Ceramic PCB Substrates manufacturing
Ceramic PCB Substrates manufacturing. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 에게 18 레이어,
Cross blind/buried via PCB manufacturing
Cross blind/buried via PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.
3D 세라믹 패키지 기판 제조
3D 세라믹 패키지 기판 제조, Advanced production technology. we offer 2D Ceramic Substrate, 2.5D Ceramic Substrate.
Mixed dielectric PCB manufacturing
Mixed dielectric PCB manufacturing.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
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