News Archives - 알칸타 기술(선전)주식회사

Custom BGA/IC Substrates play a crucial role in modern semiconductor packaging, serving as the bridge between the silicon chip and the printed circuit board (PCB). IC substrates provide electrical connections, 기계적 지지, and thermal dissipation pathways, ensuring the functionality and reliability of advanced electronic devices. Among various packaging technologies, Ball…

The rapid evolution of semiconductor technology has driven the need for more advanced packaging solutions to meet the increasing demands of high-performance computing, 일체 포함, and data-intensive applications. Traditional organic and silicon-based substrates are facing limitations in electrical performance, 열 관리, and miniaturization. 결과적으로, Custom Glass Class Package Substrate…

A Custom QFN/QFP Lead Frame is a specialized metal framework designed to provide electrical connections, 기계적 지지, and thermal dissipation for semiconductor devices using QFN (쿼드 아파트가 없습니다) or QFP (쿼드 플랫 패키지) packaging. These lead frames are tailored to meet specific design and performance requirements, ensuring optimal functionality in…

Custom FCBGA Package Substrate Service plays a pivotal role in advancing modern semiconductor packaging solutions. As a tailored service, it focuses on designing and manufacturing specialized substrates for FCBGA (플립칩 볼 그리드 어레이) packaging, a technology widely recognized for its high-performance and miniaturization capabilities. FCBGA packaging relies on flip-chip technology…

Semiconductor packaging plays a crucial role in modern electronics, serving as the bridge between integrated circuits (IC) and external components. It not only protects delicate semiconductor chips but also ensures efficient electrical connections and thermal management. As electronic devices become more compact and powerful, advanced packaging solutions are essential to…

The Small Outline Integrated Circuit (노즐) is a compact, surface-mount technology (SMT) package widely used in the electronics industry. Known for its small size and ease of assembly, SOIC is ideal for space-constrained applications like consumer electronics, automotive systems, and communication devices. It offers a balance between functionality and cost-effectiveness,…