TSOP/LOC 리드 프레임 응용 프로그램에 대한 포괄적 인 안내서
The TSOP/LOC Lead Frame is a crucial component in modern electronic packaging, enabling efficient and compact integration of semiconductor devices. TSOP, or Thin Small Outline Package, is designed for high-density applications, while LOC, or Lead-on-Chip, enhances electrical performance by minimizing wire bonding lengths. Together, the TSOP/LOC Lead Frame offers a…
플라스틱 리드 칩 캐리어의 구조 (plcc) 리드 프레임
PLCC is a type of integrated circuit (IC) package that features leads extending from the sides of the chip carrier. The lead frame within the PLCC serves as the structural and electrical backbone, connecting the IC to the external circuitry. PLCC lead frames are widely used in applications like microprocessors,…
얇은 쿼드 플랫 팩 리드 프레임에 대한 포괄적 인 가이드
Semiconductor packaging plays a crucial role in modern electronics, serving as the protective enclosure for integrated circuits while facilitating their connection to external systems. As devices continue to shrink and demand for higher performance grows, packaging solutions must evolve to meet these challenges. Among various packaging technologies, the Thin Quad…
플라스틱 듀얼 인라인 패키지의 구조 (PDIP) 리드 프레임
The Plastic Dual In-line Package (PDIP) Lead Frame is a critical component in the world of electronics, forming the backbone of one of the most widely used integrated circuit packaging formats. A Plastic Dual In-line Package (PDIP) is a type of chip packaging characterized by two parallel rows of pins,…
오른쪽 쿼드 플랫 비 리드 프레임 크기를 선택하는 방법
The Quad Flat Non-Lead Frame (QFN) is a compact and efficient surface-mount packaging technology widely used in modern electronic devices. Characterized by its leadless design, the Quad Flat Non-Lead Frame enables direct connection of the package to the printed circuit board (PCB) through exposed pads, improving electrical and thermal performance.…
비 리드 패키지의 재료 및 디자인 (QFN) 리드 프레임
In the fast-paced world of modern electronics, 콤팩트, efficient, and reliable packaging solutions are essential to meet the demands of high-performance devices. Quad Flat No-Lead (QFN) packaging has emerged as a game-changer, offering a leadless design that ensures improved thermal performance, excellent electrical characteristics, and space-saving advantages. Its popularity spans…
전화: +86 (0)755-8524-1496
이메일: info@alcantapcb.com