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Semiconductor packaging plays a critical role in modern electronics by protecting delicate microchips and ensuring reliable electrical connections between the chip and external components. As the backbone of electronic systems, packaging allows semiconductors to function effectively in various devices, from smartphones to automotive electronics. One of the key elements in…

QFN (Quad Flat No-Lead) packaging has revolutionized modern electronics by enabling compact, efficient, and high-performance component integration. This packaging style, known for its small size, 우수한 열 성능, and electrical efficiency, is widely adopted in industries ranging from consumer electronics to automotive and industrial applications. At the heart of QFN…

The Ceramic FCBGA Substrate is a type of advanced electronic packaging that uses ceramic materials to support flip chip ball grid array (FCBGA) components. It offers exceptional thermal conductivity, 기계적 강도, and electrical insulation, making it ideal for high-performance applications in industries such as telecommunications, 자동차, 그리고 가전제품. 그만큼…

The Glass FCBGA Substrate represents a breakthrough in advanced semiconductor packaging, offering a robust alternative to traditional organic substrates. Composed of specialized glass materials, this substrate is designed to meet the ever-increasing demands for miniaturization, high performance, and thermal stability in modern electronics. Its low thermal expansion coefficient, excellent electrical…

리드 프레임&QFN 제조업체용 금속 프레임, 리드 프레임 재질은 C-194F.H입니다., 리드프레임에 은도금(금속 프레임) 또는 리드프레임에 Au 도금(금속 프레임), 우리는 고품질과 빠른 리드타임으로 QFN 메탈 프레임/리드프레임을 생산합니다.. 리드프레임은 집적회로 패키징의 필수 구성요소입니다. (IC), particularly…

QFN 패키지 제조사용 리드 프레임, QFN 금속 프레임 생산, 우리는 QFN 금속 프레임 표면 처리를 은도금 또는 Au 도금으로 처리했습니다., about the silver and Au thickness, We will plating thickness according to your requirement. In the world of semiconductor packaging, the lead frame plays…