What is Rigid-Flex BGA Substrate?
Rigid-flex BGA substrate manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
What is a ceramic packaging substrate?
Ceramic package substrate. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
What is Rigid-Flex BGA Substrate?
Rigid-Flex BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.
What is ABF Substrate?
We are a professional ABF Substrate Manufacturer, 極小バンプピッチ基板を主に生産しております, ultra-small trace and spacing packaging substrate.
BT マテリアル PCB
bt-materials-pcb. we have produced boards with BT material. This material has different thicknesses. Like: 0.1んん. 0.15んん.0.2んん.0.25んん.0.3mm to 1.6mm. We produce the BT PCB with High quality and fast lead time. BT resin materials have excellent mechanical, 熱, and electrical properties.
What are the rules of packaging?
Design rules of substrate in packaging manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. In today's digital age, a new era of electronic devices and technology is evolving rapidly. One of the drivers of this advancement is packaging technology and substrate design…
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