Global Flip Chip Package Substrate
Flip Chip Package Substrate suppliers.We have used the Msap and Sap technology to produce the Flip Chip Package Substrates from 4 L to 16 レイヤー. The substrates base(コア) materials are the BT base materials. ABF base materials. High frequency and high speed materials. その他. Our company offer high quality…フリップチップパッケージ基板
Flip Chip Packaging Substrate Manufacturing. 90% of our production equipments were purchased in Japan. We use advanced manufacturing equipment to produce ultra-small spacing substrates. のような: 10 layer Package Substrates. 12 Layer Package Substrates. 18 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a…Flip-Chip Package Substrate
Flip-Chip Package Substrate manufacturers. FC BGA Package Substrate Suppliers. We have made ABF base Package Substrates from 4 レイヤーに 18 レイヤー. Ultra-small line width/line spacing with 9um/ 9um. and small size BGA pads. and More bigger than 20um line width and line spacing will be easier to produce. we…Build-up Structure FC-BGA/Organic Package
Build-up Structure FC-BGA/Organic-package , ABF Substrates Supplier leads the industry as a premier manufacturer.With expertise spanning from 4-layer to 14-layer designs, our commitment to excellence is evident in our smallest gap ABF substrates. Employing the SAP technology, we harness the power of ABF base materials to deliver unparalleled quality.FC-BGA Substrates Manufacturer
FC-BGA Substrates manufacturer. we have poroduced FC-BGA Substrates from 4 レイヤーに 14 レイヤー. when we use the ABF base materials with the Sap technology. we can produce the substrates with 15um /15um gap and trace. In today's world, electronic devices have become an integral part of our lives. From smartphones…ABF Substrates Supplier
ABF Substrates Supplier . Smallest gap ABF Substrates manufacturer from 4 レイヤーに 14 レイヤー. when we use the Sap technology. we need to choose the ABF base materials to produce the substrates. we can produce 10 layer o to 14 layer HDI substrates. the substrates gap and trace are…