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Jalada la habari - Ukurasa 2 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 2

  • What is Small Outline Integrated Circuit (SOIC)

    Je! Ni nini muhtasari mdogo wa mzunguko (Nozzles)

    The Small Outline Integrated Circuit (Nozzles) is a compact, surface-mount technology (Smt) package widely used in the electronics industry. Known for its small size and ease of assembly, SOIC is ideal for space-constrained applications like consumer electronics, Mifumo ya Magari, na vifaa vya mawasiliano. It offers a balance between functionality and cost-effectiveness,…
  • Comprehensive Guide to TSOP/LOC Lead Frame Applications

    Mwongozo kamili wa TSOP/LOC inayoongoza matumizi ya sura

    The TSOP/LOC Lead Frame is a crucial component in modern electronic packaging, enabling efficient and compact integration of semiconductor devices. TSOP, or Thin Small Outline Package, is designed for high-density applications, while LOC, or Lead-on-Chip, enhances electrical performance by minimizing wire bonding lengths. Pamoja, the TSOP/LOC Lead Frame offers a
  • Structure of Plastic Leaded Chip Carrier (PLCC) Lead Frame

    Muundo wa plastiki iliyoongozwa na chip (Plcc) Sura ya risasi

    PLCC is a type of integrated circuit (IC) package that features leads extending from the sides of the chip carrier. The lead frame within the PLCC serves as the structural and electrical backbone, connecting the IC to the external circuitry. PLCC lead frames are widely used in applications like microprocessors,…
  • Comprehensive Guide to the Thin Quad Flat Pack Lead Frame

    Mwongozo kamili kwa sura nyembamba ya quad gorofa inayoongoza

    Ufungaji wa semiconductor una jukumu muhimu katika vifaa vya elektroniki vya kisasa, serving as the protective enclosure for integrated circuits while facilitating their connection to external systems. As devices continue to shrink and demand for higher performance grows, packaging solutions must evolve to meet these challenges. Kati ya teknolojia mbali mbali za ufungaji, the Thin Quad
  • Structure of Plastic Dual In-line Package (PDIP) Lead Frame

    Muundo wa kifurushi cha chini cha mstari wa plastiki (Pdip) Sura ya risasi

    The Plastic Dual In-line Package (Pdip) Lead Frame is a critical component in the world of electronics, Kuunda uti wa mgongo wa moja ya fomati za ufungaji zilizotumiwa sana. Kifurushi cha chini cha mstari wa plastiki (Pdip) ni aina ya ufungaji wa chip unaoonyeshwa na safu mbili zinazofanana za pini,…
  • How to Choose the Right Quad Flat Non-Lead Frame Size

    Jinsi ya kuchagua saizi ya sura isiyo ya quad isiyo ya kuongoza

    Sura ya quad isiyo ya kuongoza (QFN) Je! Teknolojia ya ufungaji na yenye ufanisi ya uso wa juu inayotumika sana katika vifaa vya kisasa vya elektroniki. Inajulikana na muundo wake usio na mwongozo, Sura ya gorofa isiyo ya kuongoza huwezesha unganisho la moja kwa moja la kifurushi kwenye bodi ya mzunguko iliyochapishwa (PCB) kupitia pedi zilizo wazi, improving electrical and thermal performance.