FC-BGA substrates Manufacturer. BT series and ABF series substrates materials. From 9um to 30um gap substrates Manufacturer. FCBGA Flip Chip Ball Grid Array packages from a subgroup of the Flip Chip package family. The FCBGA package is the main platform in this sub-group, which also includes bare die, stiffener only and a thermally enhanced version with one /two piece heat spreader or lid(FCBGA-H), Mfumo-katika-pakiti(FCBGA-SIP) versions and a package subsystem meeting the standard BGA footprint that contains multiple components within the same package(FCBGA-MPM).Options also include configurations with thin core, Pb-free and copper column bumps. Flip Chip BGA packages are available in ball counts ranging from 210 kwa 3000+, board unit sizes from 10*10mm to 55*55mm. Or other types units size we also can produce them. and we have made 20 layers ABF(Ajinomoto) FCBGA substrates with 9um trace/spacing.
ALCANTA offers a complete Fcbga portfolio for the network, computing and consumer markets, Demand for greater functionality and significantly higher processing speeds in consumer and networking devices is driving flip chip technology to provide cost effective, scalable packages with ultra low K dielectrics, high power integrity , superior thermal performance and higher resistance to electromigration(EM) in very large package sizes, with very fine bump pitches and lead-free solder.
FCBGA package substrate manufacturer,Sehemu ndogo ya kifurushi cha Flip-Chip,we have made the 4 Tabaka kwa 20 layers ball Pitch with 100um(4mil).The best smallest Trace width/Spacing:9um/9um, Laser kupitia saizi ya kuchimba 50um. na 25um(1mil) Kwa laser kupitia pete ya shaba. the pads to pads gap are 9um. Teknolojia ya juu ya kifurushi cha FCBGA. Boresha utendaji wa umeme na ujumuishe utendaji wa juu wa IC: Alcanta Flip Chip BGA (Fcbga) Vifurushi vimekusanyika karibu na hali - ya sanaa, Sehemu moja laminate au sehemu ndogo za kauri. Kutumia tabaka nyingi za juu za wiani, Laser iliyochimbwa kipofu, Kuzikwa na vifungo vilivyowekwa, na laini ya laini/nafasi ya metallization, Sehemu ndogo za FCBGA zina wiani wa hali ya juu zaidi unaopatikana. Kwa kuchanganya unganisho la chip ya flip na teknolojia ya hali ya juu ya hali ya juu, Vifurushi vya FCBGA vinaweza kubuniwa kwa umeme kwa utendaji wa juu wa umeme. Mara tu kazi ya umeme inapofafanuliwa ,Kubadilika kwa muundo kuwezeshwa na Chip ya Flip pia inaruhusu chaguzi muhimu katika muundo wa mwisho wa kifurushi. Amkor hutoa ufungaji wa FCBGA katika aina ya fomati za bidhaa ili kutoshea mahitaji anuwai ya matumizi ya mwisho.
Flip Chip Packaging Substrate
Suluhisho la Substrate ya Kifurushi cha Chip: Mnyororo wa tasnia ya semiconductor chip inaweza kugawanywa katika sehemu tatu: Chip deisng, Viwanda vya Chip, and packaging and testing. Sehemu ndogo ya ufungaji wa chip ya semiconductor ni mtoaji muhimu katika mchakato wa ufungaji na upimaji. Sehemu ndogo ya ufungaji hutoa msaada, Ugawanyaji wa joto na ulinzi kwa chip, na pia kati ya meli na PCB. Toa nguvu na miunganisho ya mitambo, Sehemu ndogo za ufungaji kawaida huwa na sifa za kiufundi kama vile nyembamba, wiani mkubwa, na usahihi wa HGH, Alcanta can rpovide chip design companice and packaging and testing companies with Layer Structure Up to 10-n-10 of wire bonding process substrates and flip-chip packaging substrates, These substrates are mainly used for micro-electromechanical systems, moduli za masafa ya redio, Chips za kumbukumbu,Sehemu ndogo na Kifurushi cha Wasindikaji wa Maombi.
About the IC Substrates. FC-BGA substrates. SHDBU substrates. Vijiti vidogo vya FC-CSP. CPCORE Substrates. Mada Ndogo za Moduli. MSD substrates, FR substrates, SEN substrates , MIC substrates design and Fabrication questions. please contact with info@alcantapcb.com