ニュースアーカイブ - ページ 30 の 96 - アルカンタテクノロジー(深セン)株式会社 - ページ 30

Military Substrate Manufacturer. High speed and High frequency material packaging substrate or HDI PCBs Manufacturer. 高度な, dedicated military circuit board production line, strict quality standards IPC Class 3.

RFモジュール基板メーカー. High frequency and High speed material packaging substrate production. We offer advanced microtrace RF packaging substrate from 2 レイヤーに 30 レイヤー.

Metal Core PCB Manufacturer, Super-thick Copper PCBs, Heavy copper PCBs, and thicker Metal base PCBs manufacture, we offer Metal core PCB and Aluminium base from 1 レイヤーに 30 レイヤー.

Microtrace BGA substrates Manufacturer. Microtrace and Microgap HDI PCBs production, We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 2 に 30 レイヤー.

Ultrathin LED PCB Manufacturer. 1 layer or 2 layer PCBs finished boards thickness are 3mil(75um), 4ミル(100um) to 6mil to 8mil, the 4 layer PCBs will be finsihed with 7mil to 15mil. or more thicker.

Ro3006 PCB Manufacturer. Rogers Series material PCB and Mixed medium Rogers PCBs production, We offer High Frequency PCBs. のような: ロ3003, ロ3006, Ro3010,Ro4360G2, ロ4835, Ro 4350B, Ro5880, and other types High Frequency boards, のように: CLTE, ゲンクラッド, RF35,FastRise27,TLC, TLX, TLY, Taconic 601, 602, 603, 605.