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RF Modules Substrate Manufacturer. High frequency and High speed material packaging substrate production. We offer advanced microtrace RF packaging substrate from 2 strat la 30 straturi.

Metal Core PCB Manufacturer, Super-thick Copper PCBs, Heavy copper PCBs, and thicker Metal base PCBs manufacture, we offer Metal core PCB and Aluminium base from 1 strat la 30 straturi.

Producător de substraturi BGA MicroTrace. Microtrace and Microgap HDI PCBs production, We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 2 la 30 straturi.

Producător de PCB LED Ultrathin. 1 strat sau 2 PCB -urile cu strat PCB -uri Grosimea sunt de 3 mil.(75unul), 4mil(100unul) până la 6 mil. 8 mil., the 4 PCB -urile cu strat va fi finalizat cu 7 mil. 15 mil.. sau mai gros.

Ro3006 PCB Manufacturer. Rogers Series material PCB and Mixed medium Rogers PCBs production, We offer High Frequency PCBs. Such as: Ro3003, Ro3006, Ro3010,Ro4360G2, Ro4835, Ro 4350B, Ro5880, and other types High Frequency boards, like: CLTE, Genclad, RF35,FastRise27,TLC, TLX, TLY, Taconic 601, 602, 603, 605.

RF High Frequency Flip Chip Substrate Manufacturer. we can produce the best smallest bump pitch with 100um, the best smallest trace are 9um.