Multi cavity substrates manufacturing
Multi cavity substrates manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types.
Microvias | Blind Vias PCB manufacturing
Microvias | Blind Vias PCB manufacturing. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 la 18.
Embedded Slot PCB Manufacturing
Embedded slot PCB manufacturing. putem produce cel mai bun pas cu 100um, cea mai bună urmă este 9um. and the smallest.
Multi cavity PCB manufacturing
Multi cavity PCB manufacturing. putem produce cel mai bun pas cu 100um, cea mai bună urmă este 9um. and the smallest gap.
Micro via PCB manufacturing
Micro via PCB manufacturing. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 la 18 straturi,
Embedded Components PCB manufacturing
Embedded Components PCB manufacturing, PCB cu cavitate încorporată, Embedded slot PCB manufacture. Open the cavity on the PCBs. we have made many this cavity PCBs with high quality.
Tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com