Trade News Archives - ページ 10 の 94 - アルカンタテクノロジー(深セン)株式会社 - ページ 10

超多層FC-LGA基板メーカー。超多層FC-LGA基板のトップメーカーとして, 私たちは高性能を提供することに特化しています, 高度な電子アプリケーション向けの信頼性の高い相互接続ソリューション. 当社の最先端の製造プロセスと厳格な品質管理により、優れた信号整合性が保証されます。, 熱管理, そして小型化. 高密度に最適, 高速コンピューティング環境, our substrates support cutting-edge technologies such…

Advanced Cavity Circuit Board Manufacturer.An advanced cavity circuit board manufacturer specializes in producing high-precision circuit boards with embedded cavities for housing components. These manufacturers leverage cutting-edge technology and innovative design techniques to create custom boards that meet the demanding specifications of industries such as aerospace, 電気通信, and medical devices. By…

フリップチップ (ABF) Substrate Manufacturer.Flip Chip (ABF) Substrate Manufacturers specialize in producing advanced build-up film (ABF) 基板, essential for high-performance semiconductor packaging. These substrates enable higher density interconnects and improved thermal management, crucial for applications in computing, 電気通信, and automotive industries. Leading manufacturers leverage cutting-edge technology and rigorous quality control…

RF Package Substrates Manufacturer.An RF Package Substrates Manufacturer specializes in producing high-performance substrates for RF applications, enabling efficient signal transmission and superior thermal management. With advanced fabrication techniques, they provide customized solutions to meet the stringent demands of the telecommunications, 航空宇宙, and defense industries. Their expertise ensures reliability and enhanced…

ISOLA 370HR PCB Manufacturer.ISOLA 370HR PCB Manufacturer specializes in producing high-performance PCBs using ISOLA 370HR material. Known for its exceptional thermal reliability and mechanical stability, ISOLA 370HR is ideal for advanced applications in aerospace, 電気通信, and industrial electronics. Our manufacturing process ensures precise construction and rigorous quality control, delivering PCBs…

Ultra-Multilayer FC-BGA Package Substrates Manufacturer.As an advanced manufacturer of Ultra-Multilayer FC-BGA Package Substrates, we specialize in providing cutting-edge solutions for high-performance computing and communication applications. Our substrates feature exceptional signal integrity, 熱管理, and high-density interconnections, ensuring superior reliability and performance. With state-of-the-art manufacturing processes and rigorous quality control, we…