Cross blind/buried via PCB manufacturing
Cross blind/buried via PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.
3D Ceramic Packages Substrate manufacturing
3D Ceramic Packages Substrate manufacturing, Advanced production technology. we offer 2D Ceramic Substrate, 2.5D Ceramic Substrate.
Mixed dielectric PCB manufacturing
Mixed dielectric PCB manufacturing.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
Microvia Substrates manufacturing
Microvia Substrates manufacturing. the best smallest vias holes size are 50um. the Package Substrate will be made with BT core, Showa DenkoとAjinomotoの高速材料. or other types core materials.
Mini Ceramics PCB manufacturing
Mini Ceramics PCB manufacturing. 100umで最高のSamllestバンプピッチを作成できます, 最も小さなトレースは9umです.
Embedded IC PCB manufacturing
Embedded IC PCB manufacturing. Open Depth control slot on the PCBs. Put the IC in the slot of the PCBs. we can use the High frequency and high speed materials.
電話番号: +86 (0)755-8524-1496
Eメール: info@alcantapcb.com