무역 뉴스 보관소 - 페이지 39 ~의 94 - 알칸타 기술(선전)주식회사 - 페이지 39

Cross blind/buried via PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

3D 세라믹 패키지 기판 제조, Advanced production technology. we offer 2D Ceramic Substrate, 2.5D Ceramic Substrate.

Mixed dielectric PCB manufacturing.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Microvia Substrates manufacturing. the best smallest vias holes size are 50um. the Package Substrate will be made with BT core, Showa Denko and Ajinomoto High speed materials. or other types core materials.

Mini Ceramics PCB manufacturing. 우리는 100um로 최고의 범프피치를 생산할 수 있습니다., 가장 작은 흔적은 9um입니다.

Embedded IC PCB manufacturing. Open Depth control slot on the PCBs. Put the IC in the slot of the PCBs. we can use the High frequency and high speed materials.