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Trade News Archives - Seite 60 von 94 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 60

  • What is organic package substrate?

    Was ist organisches Paketsubstrat??

    Organic package substrate and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 Zu 18 Lagen. Packaging substrates, an essential element within electronic devices, assume a pivotal role. They serve as a vital bridge connecting a multitude of electronic components, chips, and circuits,…
  • Why is it called LED packaging substrate?

    Warum wird es als LED -Verpackungssubstrat bezeichnet?

    Wir sind ein professionelles LED -Paket -Substrat, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Trace- und Abstandspaket-Substrat und PCBs. LED (Licht emittierende Diode) Die Technologie hat sich nahtlos in den Stoff zeitgenössischer Beleuchtung integriert, elektronische Geräte, und die Automobilindustrie. The extensive utilization of LEDs has not
  • What is substrate in IC packaging?

    Was ist Substrat in der IC -Verpackung?

    This article embarks on an exploration of IC packaging substrates, an indispensable element within the realm of electronics. We will conduct an in-depth examination of the diverse types of IC packaging substrates, delve into current market trends, and underscore their paramount significance within the modern electronics industry. Whether you're an
  • What is the substrate of ICs?

    Was ist das Substrat von ICs?

    In today's digital era, Integrated Circuits (ICs) stand as the vital components propelling electronic devices and technology into the future. These minuscule yet immensely powerful chips function as the cognitive centers of electronic devices, housing millions of transistors that execute a diverse array of tasks. Jedoch, IC chips alone do
  • What is the substrate of the flip chip package?

    Was ist das Substrat des Flip -Chip -Pakets??

    We are a professional flip chip package substrate, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Trace- und Abstandspaket-Substrat und PCBs. Flip -Chip -Verpackung, Eine modernste Technologie in der Welt der Elektrotechnik, hat die Art und Weise revolutioniert, wie Mikrochips und elektronische Komponenten verbunden und verpackt sind. In diesem Artikel,…
  • Are the two most common materials used in an IC package?

    Sind die beiden häufigsten Materialien, die in einem IC -Paket verwendet werden?

    Different types of ic packaging substrates manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. In the realm of modern electronic devices, the Integrated Circuit Package Substrate (IC package substrate) plays a pivotal role, serving as the crucial link between microchips and the