News Archives - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD

FC-BGA-Designregeln & production process capabilities FC-BGA design rules & Produktionsprozessfähigkeiten, FC-BGA-Substrate sind Halbleiterpakete mit feiner Entwurfsregel und hoher Zuverlässigkeit,Das Standard -Substrat -Design von FCBGA -Verpackungen ist 8 Zu 16 Lagen, and the material used is Japanese ABF (Ajinomoto) Film, Zum Beispiel: GX92R, GXT31R2, GZ41R2H,…

Custom BGA/IC Substrates play a crucial role in modern semiconductor packaging, serving as the bridge between the silicon chip and the printed circuit board (Leiterplatte). IC substrates provide electrical connections, mechanische Unterstützung, and thermal dissipation pathways, ensuring the functionality and reliability of advanced electronic devices. Among various packaging technologies, Ball…

The rapid evolution of semiconductor technology has driven the need for more advanced packaging solutions to meet the increasing demands of high-performance computing, KI, and data-intensive applications. Traditional organic and silicon-based substrates are facing limitations in electrical performance, Wärmemanagement, and miniaturization. As a result, Custom Glass Class Package Substrate…

Ein benutzerdefinierter QFN/QFP -Bleirahmen ist ein spezielles Metallrahmen für elektrische Verbindungen, mechanische Unterstützung, und thermische Dissipation für Halbleitergeräte unter Verwendung von QFN (Quad Flat No-Lead) oder QFP (Quad -Flat -Paket) Verpackung. Diese Lead -Rahmen sind auf bestimmte Design- und Leistungsanforderungen zugeschnitten, Gewährleistung einer optimalen Funktionalität in…

Custom FCBGA Package Substrate Service plays a pivotal role in advancing modern semiconductor packaging solutions. As a tailored service, it focuses on designing and manufacturing specialized substrates for FCBGA (Flip-Chip Ball Grid Array) Verpackung, a technology widely recognized for its high-performance and miniaturization capabilities. FCBGA packaging relies on flip-chip technology…

Semiconductor packaging plays a crucial role in modern electronics, serving as the bridge between integrated circuits (ICs) and external components. It not only protects delicate semiconductor chips but also ensures efficient electrical connections and thermal management. As electronic devices become more compact and powerful, advanced packaging solutions are essential to…