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リジッドフレックスPCB/

フレックス PCB の製造

フレックス PCB の製造

 

Flexible printed circuit, also known as a flexible circuit board, flex PCB, or FPC for short, has the advantages of high wiring density, lightweight, thin thickness, less wiring space limitation, and high flexibility. It fully conforms to the development trend of light and short electronic products and is an effective solution to meet the requirements of miniaturization and mobility of electronic products.

 

Layer count —— 2L

Material —— PI

▪ 板厚 —— 0.15 ±0.01 mm

▪PIの厚さ — — 0.015 んん

▪ 分. LW/LS —— 0.15/0.15mm

▪ 分. ドリルサイズ —— 0.15 んん

▪ 表面仕上げ —— ENIG

Our flex PCB fabrication capability

ProjectSampleBatch
Product typeSingle FPC, double-sided FPC board,

layered board,hollowed-out FPC board,

multi-layer FPC,rigid-flex board

Single FPC, double-sided FPC board, layered board,

hollowed-out FPC board, multi-layer FPC, rigid-flex board

Number of layers1-8 layer flexible circuit board1-6 layer flexible circuit board
Maximum finished size250*4000んん250*4000んん
Plate thickness0.06んん – 1.0んん0.08んん – 0.8んん
Minimum line width / 間隔 0.045mm/0.045mm0.045/0.045MM
材料PI (polyimide), PET, RA copper, ED copperPI (polyimide), PET, RA copper, ED copper
Thickness tolerance of finished

product

±0.03mm±0.03mm
Copper thickness12UM 18UM 36UM 70UM12UM 18UM 36UM 70UM
Insulation thickness12.5um 25UM 50UM12.5UM 25UM 50UM
Minimum hole diameterNumerical control 0.15mm, laser 0.1mmNumerical control 0.15mm, laser 0.1mm
Tolerance (plated through hole)±0.05mm±0.05mm
StiffenerFR4/PI/PET/SUS/PSAFR4/PI/PET/SUS/PSA
Surface treatmentGold, 銀, gold, tin, OSPGold, 銀, gold, tin, OSP
Finished product impedance

control

50Ω -120Ω50Ω -120Ω
Acceptance criteriaFactory standard; GB; IPC-650; IPC-6012;

IPC-6013 class II; IPC-6013 class III;

military standard; others

Factory standard; GB; IPC-650; IPC-6012;

IPC-6013 class II; IPC-6013 class III; military standard;

others

Environmental certification

report

ROHS certification; SGS test report;

reach 168 test reports; ISO14000; others

ROHS certification; SGS test report;

reach 168 test reports; ISO14000; others

 

認証取得

製品認証: UL, CQC
マネジメントシステム認証: ISO9001, TS16949, TL9000, QC080000, GJB 9001, IS014001, OHSAS18000

プロセス能力

従来基板最多 (L): 50
Rigid-F lex PCB board the highest level (L): 36
Rigid-F lex PCB board buildup: 一次, 二次積層穴, 二次穴, 3次穴, 四次穴

材料 :

FR4: EM827, 370人事部, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF

高速:メグトロン6, メグトロン4, メグトロン7、TU872SLK, FR408HR,N4000-13シリーズ, MW4000, MW2000, TU933

高周波:ロ3003, ロ3006, ロ4350B, Ro4360G2, ロ4835, CLTE, ゲンクラッド, RF35, ファストライズ27

その他:PP, CVL, EMI, PI, ポリイミド, タカ, LCP, BT, C層, フラッドフレックス, オメガ , ZBC2000,

 

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