Company News Archives - ページ 32 の 86 - アルカンタテクノロジー(深セン)株式会社 - ページ 32

Military circuit board Manufacturer. High speed and high frequency material Military HDI PCBs production, We offer IPC Class III Military boards from 2 レイヤーに 50 レイヤー.

レーダーHF基板メーカー, we mainly produce ultra-small bump pitch Radar HF substrate from 2 レイヤーに 30 レイヤー, ultra-small trace and spacing BGA packaging substrate or HDI PCBs.

Glass Package Substrates Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4,

Ultra-thin hard PCB Manufacturer. the finished boards thickness are from 3mil(0.07んん), 0.1んん, 0.12んん, 0.15んん, 0.17mm to 0.3mm. Rigid core(base) materials Ultra-thin PCBs Vendor. のような: 高TG FR4素材, BT materials, and other High speed and high frequency materials. we use this types hard core to produce the Ultra-thin boards…

Rogers RT5880 High Frequency PCB Manufacturer. For the Antenna, Radar, Aviation, Rogers RT5880 PCB Vendor. We offer Rogers 5880 PCB with Mixed dielectric layer, Cavity, embedded Cavity Rogers PCBs. We have made this types Rogers PCBs from 2 レイヤーに 30 レイヤー. High quality and fast shipping time.

Wire Bonding BGA substrates Manufacturer, 極小バンプピッチ基板を主に生産しております, ultra-small trace and spacing packaging. BGA/IC wire bonding. the High frequency and high frequency materials Wire Bonding BGA substrates.