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Ceramic Packages for MEMS Sensors manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection Ceramic substrates with Super small spacing super small marks. the layers are from 4 レイヤーに 20 レイヤー.

プリント基板製造, Specializing in the production of ultra-small gap, ultra-small hole, multi-layer HDI, high-speed materials, high-frequency materials, soft and hard combination process PCBs. we have made 108 layers HDI PCBs with high quality. そして、速い出荷時間.

Custom PCB Manufacturer. HDI PCB fabrication from 4 レイヤーに 100 レイヤー. Rigid PCBs, Flex PCBs, Rigid-Flex PCBs, AL PCBs, High speed and high frequency or packaging substrate manufacturers. The professional production plant has more than 10,000 employees, advanced production equipment and technology.

Copper Base PCB Supplier. Super thick metal PCB, Embedded metal core PCB production. we have made multilayer metal PCB from 4 レイヤーに 8 レイヤー. or other Mixed media metal PCB fro 4 レイヤーに 50 レイヤー.

PCB Board Manufacturer. Rigid PCB, Flex PCBs, HDI PCB, High speed and high frequency Vendor. 私たちはPCBを提供しています 2 レイヤーに 108 レイヤー. We can also produce special process PCBs with high quality. のような: mixed media, キャビティ PCB, FC bga substrates from 4 レイヤーに 20 レイヤー.

IPCクラス 3 PCBs Manufacturer. Military electronics quality standard IPC Class 3. We have a professional military, aviation circuit board production line. More than 10,000 employees. high quality and fast delivery.