Nyaraka za Habari za Kampuni - Ukurasa 39 ya 86 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 39

3D Ceramic Packages Substrate manufacturing, Advanced production technology. we offer 2D Ceramic Substrate, 2.5D Ceramic Substrate.

Mixed dielectric PCB manufacturing.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Microvia Substrates manufacturing. the best smallest vias holes size are 50um. the Package Substrate will be made with BT core, Showa Denko and Ajinomoto High speed materials. or other types core materials.

Mini kauri PCB Viwanda. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Utengenezaji wa IC PCB ulioingia. Fungua kina cha kudhibiti kina kwenye PCB. Weka IC katika yanayopangwa ya PCB. Tunaweza kutumia masafa ya juu na vifaa vya kasi kubwa.

Viwanda vya PCB vilivyoingia. Fungua cavity ya kudhibiti kina kwenye PCB. au anuwai nyingi kwenye PCB. Tumefanya PCB hii nyingi kutoka 4 Tabaka kwa 30 tabaka. Kutumia masafa ya juu na vifaa vya kasi ya juu.