Rigid-Flex Packaging Substrate Firm
Rigid-flex packaging substrate Firm. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates.
Semiconductor FC-BGA substrate Manufacturer
Semiconductor FC-BGA substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection.
Producător de substraturi BGA semiconductor
Semiconductor BGA substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate
Producător de substrat IC semiconductor
Producător de substrat IC semiconductor. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
Producător de substrat de pachete ceramice
Producător de substrat de pachete ceramice. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 la 18 straturi
Producător de pachete de substrat
Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
Tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com