Producător global de substrat de pachete
Producător global de substrat de pachete. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production.
Producător de substraturi ale modulului
Producător de substraturi ale modulului, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs from 4 strat la 20 straturi.
Producător global de substrat cu semiconductor
Producător global de substrat cu semiconductor. We use advanced Msap and Sap technology to manufacturing High multilayer interconnection package substrates.
Producător de structură CPCORE
Producător de structură CPCORE. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 4 la 18 straturi.Producător de substraturi FC-CSP
Producător de substraturi FC-CSP. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other types base materials.
Producător de substrat de pachete de mare viteză
High Speed package Substrate Manufacturer. High speed and high frequency material PCB and packaging substrate manufacturing.
Tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com