FCCSP Flip Chip Package Substrate
FCCSP Flip Chip Package Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace and spacing are 9um/9um. Use the Ajinomoto(ABF) base material or other types High frequency and high speed substrate materials.
BGA Cavity Substrate Manufacturer
BGA Cavity Substrate Manufacturer. We are professional Cavity PCB & Embedded components and parts substrates company. We can do the cavity slot with the Mixed dielectric layer.
Producător de ambalaje organice
Producător de ambalaje organice. We use advanced Msap and Sap technology to make the High multilayer interconnection package substrates from 4 la 20 straturi. and our company also do the Organic Packaging service.
Producător de substrat de pachete BT FCCSP
Producător de substrat de pachete BT FCCSP. the Package Substrate will be made with BT base, Showa Denko and Ajinomoto High speed materials. or other types High speed and high frequency materials.
Producător de substrat de pachete CSP
Producător de substrat de pachete CSP. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate firm.
Flip Chip CSP Package Substrate Manufacturer
Flip Chip CSP Package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing.Advanced technology and equipments.
Tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com