Company News Archives - Pagină 49 of 86 - TEHNOLOGIA ALCANTA(SHENZHEN)CO., LTD - Pagină 49

Chip-scale package and scale package substrates Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging service vendor.

Producător de substrat PCB cu cavitate încorporată. High speed and high frequency material Cavity packaging substrate and Cavity slot PCB manufacturing.

FCCSP Flip Chip CSP pachet substraturi Producator. Folosim tehnologia avansată Msap și Sap pentru a produce substraturi de pachete FCCSP Flip Chip CSP cu interconexiune multistrat înalt. și facem, de asemenea, serviciul de pachete FCCSP.

Producător de substrat pentru PCB cu cavitate. Professional Cavity PCB and Embedded component substrates factory. We use advanced embedded production processes.

Flip Chip CSP (FCCSP) Firm. We produce the High speed and high frequency material packaging substrate from 2 strat la 20 straturi. we also offer the Flip Chip CSP package service.

Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 strat la 30 straturi.