Firmennachrichtenarchive - Seite 45 von 86 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 45

Hersteller von Substratverpackungen. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 Zu 18 Lagen,

Spitze 10 Hersteller von Verpackungssubstraten, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, ultra-small trace packaging substrate from 2~20L

Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 Schicht zu 20 Lagen.

Global Packaging Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Spitze 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 Schicht zu 20 Lagen.

Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.