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Hersteller von Substratverpackungen. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 Zu 18 Lagen,

Spitze 10 Hersteller von Verpackungssubstraten, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, ultra-small trace packaging substrate from 2~20L

Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 Schicht zu 20 Lagen.

Global Packaging Substrate Manufacturer. Mit 100 µm können wir den kleinsten Bump-Pitch herstellen, the best smallest trace are 9um.

Spitze 10 Paket Substrathersteller. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 Schicht zu 20 Lagen.

Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.