Firmennachrichtenarchive - Seite 48 von 86 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 48

Hersteller von FCCSP-Flip-Chip-Gehäusesubstraten. Mit 100 µm können wir den kleinsten Bump-Pitch herstellen, Die besten kleinsten Leiterbahnen und Abstände sind 9 µm/9 µm. Benutze das Ajinomoto(ABF) Grundmaterial oder andere Arten von Hochfrequenz- und Hochgeschwindigkeits-Substratmaterialien.

Hersteller von BGA-Hohlraumsubstraten. We are professional Cavity PCB & Embedded components and parts substrates company. We can do the cavity slot with the Mixed dielectric layer.

Organic Packaging Manufacturer. We use advanced Msap and Sap technology to make the High multilayer interconnection package substrates from 4 Zu 20 Lagen. and our company also do the Organic Packaging service.

Hersteller von BT FCCSP-Paketsubstraten. the Package Substrate will be made with BT base, Showa Denko and Ajinomoto High speed materials. or other types High speed and high frequency materials.

CSP package substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate firm.

Flip Chip CSP Package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing.Advanced technology and equipments.