Firmennachrichtenarchive - Seite 50 of 86 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 50

Flip Chip CSP (FCCSP) Firm. We produce the High speed and high frequency material packaging substrate from 2 Schicht zu 20 Lagen. we also offer the Flip Chip CSP package service.

Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 Schicht zu 30 Lagen.

Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Semiconductor FC BGA substrate quote. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

We are a professional Rigid-flex BGA substrate quote, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Trace und PCBs.

We are a professional Rigid-flex packaging substrate quote supplier, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, ultra-small trace.