Firmennachrichtenarchive - Seite 52 of 86 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 52

Advance Semiconductor substrate manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Hersteller des erweiterten Verpackungssubstrats. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Rigid-flex BGA substrate manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Ceramic package substrate. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Rigid-Flex BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

We are a professional ABF Substrate Manufacturer, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Spuren- und Abstandsverpackungssubstrat.