Firmennachrichtenarchive - Seite 52 of 86 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 52

Advanced packaging substrate manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Rigid-flex BGA substrate manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Ceramic package substrate. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Rigid-Flex BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

We are a professional ABF Substrate Manufacturer, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Spuren- und Abstandsverpackungssubstrat.

bt-materials-pcb. we have produced boards with BT material. This material has different thicknesses. Like: 0.1mm. 0.15mm.0.2mm.0.25mm.0.3mm to 1.6mm. We produce the BT PCB with High quality and fast lead time. BT resin materials have excellent mechanical, thermal, und elektrische Eigenschaften.