What are the advanced packaging processes?
What is the FC BGA Package? FC BGA Package Reference Guide. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 Schicht zu 18 layer
Flip Chip Package Substrate Technology
Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. Such as: 10 layer Flip-Chip Package Substrates. 12 layer. 14 layer. oder 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…
Ultra-Small Pitch Substrate
Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. So. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!
Advanced Package Substrate
Advanced Package Substrate manufacturer. We have used Msap and Sap technological process to produce the Package substrates with the Rogers Materials BT Materials, ABF Materials, and other types Materials. The range of main layers of our products is from 4 Schicht zu 18 Lagen. our company asways made the 10…
Waht’s the MSAP and SAP Processes?
Waht's the MSAP and SAP Processes.We have used the Multilayer Sequential Build-Up (MSAP) and Semi-Additive Processes (SAP). To do the traces/spacing with 9um/9um FC BGA packaging substrates.These groundbreaking methodologies have revolutionized PCB production, offering unparalleled capabilities that propel the industry to new heights of innovation and efficiency.
FC BGA Packaging Substrate
FC BGA Packaging Substrate Supplier. We have used the Msap and Sap technology to produce the the smallest Packaging Substrate with 9um gap. and the lines width are 9um too. we can produce the FC BGA Packaging Substrate from 2 Schicht zu 16 Lagen. the best smallest via holes size…
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Email: info@alcantapcb.com