Company News Archives - ページ 58 の 86 - アルカンタテクノロジー(深セン)株式会社 - ページ 58

RT-デュロイド 6035 プリント基板, RT 6035 プリント基板の製造, RT/duroid 6035HTC laminates are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. さらに, Rogers advanced filler…

oid® 5880 プリント基板, RT5880 PCB board. Alcanta factory produce RT 5880 material Boards from 2 レイヤーに 20 レイヤー. HDI RT5870 materials, RT5880 materials. RT 6002 材料, Cavtiy PCBs. high quality HDI PCBs, and fast shipping time.

BGA Substrates PCB Fabrication. Alcanta PCB has made many 2 レイヤーに 10 layers BGA Substrates PC Board. and the drilling ways are any layers interconnection. high quality and fast shipping time.

FC-BGA基板 (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions. We have developed ultra high density wiring substrates with our original microfabrication and build-up wiring technologies, offering products supporting current semiconductor microfabrication.For a growing demand for LSIs for…

メグトロン 7 PCBサプライヤー,メグトロン7GN,R-5785(おやすみなさい)/R-5680(おやすみなさい),メグトロン7GE, R-5785(GE)/R-5680(GE), 超低損失,高耐熱基板材料. 超低誘電率 (DK) および散逸率 (Df) make MEGTRON 7 ideal for high speed and large data volumes associated with servers and routers required for 5G. The MEGTRON 7 family, including MEGTRON 7(N), 私を玉座にしてください 7(GE) そして…

Minimum Trace&Gap PCB manufacturer. The smallest clearance between trace to trace or Pads to Pads are 1.4mil(35um). we offer the smallest Pads Pitch with 160um(7.1ミル). Such as FCBGA packaging products.