Company News Archives - ページ 60 の 86 - アルカンタテクノロジー(深セン)株式会社 - ページ 60

Backdrilling PCB Fabrication, Back drilling HDI PCB board Manufacturing. Back drilling (a.k.a controlled depth drilling or CDD) involves using a drill bit slightly larger in diameter than the PTH to remove the conductive plating or stub from the hole. In practice this is achieved by re-drilling the PTH down to…

Ultrathin Bluetooth PCB Fabrication. Smallest size Bluetooth Circuits Manufacturing. Ultrathin Multilayer Bluetooth PCB manufacturers. Ultrathin Bluetooth PCB. Low cost and High quality.

セラミック基板PCB製造. Ceramic Multilayer PCB Manufacturing, Ceramic substrate refers to a special process board where copper foil is directly bonded to the surface (single side or double side) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. Compared with traditional FR-4 or aluminum substrate, the…

Megtron7GE Multilayer PCB Fabrication.R-5785(GE) & R-5680(GE) プリント基板の製造. とR5785(おやすみなさい)&R5680(おやすみなさい) プリント基板製造. Alcanta PCB 会社は、品質グレードの IPC クラスを備えた Megtron7 シリーズ回路基板を提供しています 3. PCBの品質は完璧です! 超低伝送損失 高耐熱性 多層基板材料 MEGTRON7 | R-5785(おやすみなさい), R-5785(GE), R-5785. We have used these…

BT circuit board manufacturer, Micro LED PCB, Mini LED PCB, Bluetooth board, and IC substrate fabrication. All of these PCBs are smallest gap PCBs. Our company offer BT PCBs. and the BT materials printed circuit board was made with high quality and fast lead time.

Micro LED PCB, Mini LED PCB, Chip LED PCB, IC substrate PCB maker. White and Black core materials. Ultrathin PCB Fabrication. and minimum spacing(gap) プリント基板メーカー.