News Archives - 페이지 32 of 96 - 알칸타 기술(선전)주식회사 - 페이지 32

Military circuit board Manufacturer. High speed and high frequency material Military HDI PCBs production, We offer IPC Class III Military boards from 2 레이어 50 레이어.

Radar HF substrate Manufacturer, we mainly produce ultra-small bump pitch Radar HF substrate from 2 레이어 30 레이어, ultra-small trace and spacing BGA packaging substrate or HDI PCBs.

Glass Package Substrates Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4,

Ultra-thin hard PCB Manufacturer. the finished boards thickness are from 3mil(0.07mm), 0.1mm, 0.12mm, 0.15mm, 0.17mm to 0.3mm. Rigid core(base) materials Ultra-thin PCBs Vendor. 와 같은: High TG FR4 materials, BT materials, and other High speed and high frequency materials. we use this types hard core to produce the Ultra-thin boards…

Rogers RT5880 High Frequency PCB Manufacturer. For the Antenna, Radar, Aviation, Rogers RT5880 PCB Vendor. We offer Rogers 5880 PCB with Mixed dielectric layer, Cavity, embedded Cavity Rogers PCBs. We have made this types Rogers PCBs from 2 레이어 30 레이어. High quality and fast shipping time.

Wire Bonding BGA substrates Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging. BGA/IC wire bonding. the High frequency and high frequency materials Wire Bonding BGA substrates.