Jalada la habari - Ukurasa 36 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 36

Radar HF substrate Manufacturer, we mainly produce ultra-small bump pitch Radar HF substrate from 2 Tabaka kwa 30 tabaka, ultra-small trace and spacing BGA packaging substrate or HDI PCBs.

Glass Package Substrates Manufacturer. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Sehemu ndogo za unganisho za multilayer kutoka 4,

Mtengenezaji wa PCB wa Ultra-nyembamba. Unene wa bodi zilizomalizika ni kutoka 3mil(0.07mm), 0.1mm, 0.12mm, 0.15mm, 0.17mm hadi 0.3mm. Msingi mgumu(msingi) Vifaa vya Ultra-nyembamba PCBS muuzaji. Kama: Vifaa vya juu vya TG FR4, Vifaa vya BT, na kasi zingine za juu na vifaa vya masafa ya juu. we use this types hard core to produce the Ultra-thin boards…

ROGERS RT5880 Mtengenezaji wa Frequency PCB. For the Antenna, Radar, Aviation, Rogers RT5880 PCB Vendor. We offer Rogers 5880 PCB with Mixed dielectric layer, Cavity, embedded Cavity Rogers PCBs. We have made this types Rogers PCBs from 2 Tabaka kwa 30 tabaka. High quality and fast shipping time.

Wire Bonding BGA substrates Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging. BGA/IC wire bonding. the High frequency and high frequency materials Wire Bonding BGA substrates.

Mini led PCB Substrate Manufacturer. The Ultra-small spacing LED PCBs will be made with BT core materials. the pads go pads gap tolerance will be more easy to control, and the finished boards will be more flat. we can use the High speed and high frequency material to do the…