Ceramic PCB Substrates manufacturing
Ceramic PCB Substrates manufacturing. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 에게 18 레이어,
Cross blind/buried via PCB manufacturing
Cross blind/buried via PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.
3D 세라믹 패키지 기판 제조
3D 세라믹 패키지 기판 제조, Advanced production technology. we offer 2D Ceramic Substrate, 2.5D Ceramic Substrate.
Mixed dielectric PCB manufacturing
Mixed dielectric PCB manufacturing.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
Microvia Substrates manufacturing
Microvia Substrates manufacturing. the best smallest vias holes size are 50um. the Package Substrate will be made with BT core, Showa Denko and Ajinomoto High speed materials. or other types core materials.
Mini Ceramics PCB manufacturing
Mini Ceramics PCB manufacturing. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
전화: +86 (0)755-8524-1496
이메일: info@alcantapcb.com