Multi cavity substrates manufacturing
Multi cavity substrates manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types.
마이크로비아 | Blind Vias PCB manufacturing
마이크로비아 | Blind Vias PCB manufacturing. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 에게 18.
Embedded Slot PCB Manufacturing
Embedded slot PCB manufacturing. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest.
Multi cavity PCB manufacturing
Multi cavity PCB manufacturing. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap.
Micro via PCB manufacturing
Micro via PCB manufacturing. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 에게 18 레이어,
Embedded Components PCB manufacturing
Embedded Components PCB manufacturing, 임베디드 캐비티 PCB, Embedded slot PCB manufacture. Open the cavity on the PCBs. we have made many this cavity PCBs with high quality.
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