News Archives - Seite 46 of 101 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 46

Micro cavity PCB manufacturing. High speed and high frequency material cavity PCB/packaging substrate manufacturing. Advanced cavity packaging substrate.

BT Epoxy Resin PCB manufacturing, Mini LED BT PCBs and BGA substrates supplier. Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Spuren- und Abstandsverpackungssubstrat.

Micro cavity substrates manufacturing. Open a micro Cavity on the PCBs or BGA package substrates. we have made many cavity PCBs from 4 Schicht zu 30 Lagen. high quality and fast lead times.

Bt laminate PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high.

Cavity substrate manufacturing. High speed and high frequency material Cavity packaging substrate manufacturing. Advanced cavity(slot) production technique. we make the cavity PCBs from 4 Schicht zu 30 Lagen.

Bt laminate substrate manufacturing, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Spuren- und Abstandsverpackungssubstrat.