News Archives - Seite 48 of 101 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 48

Semiconductor IC substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 Zu 18 Lagen

Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Hersteller von Substratverpackungen. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 Zu 18 Lagen,

Spitze 10 Hersteller von Verpackungssubstraten, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, ultra-small trace packaging substrate from 2~20L

Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 Schicht zu 20 Lagen.