News Archives - Seite 49 von 101 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 49

Global Packaging Substrate Manufacturer. Mit 100 µm können wir den kleinsten Bump-Pitch herstellen, the best smallest trace are 9um.

Spitze 10 Paket Substrathersteller. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 Schicht zu 20 Lagen.

Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Globaler Paketsubstrathersteller. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production.

Module Substrates Manufacturer, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, ultra-small trace and PCBs from 4 Schicht zu 20 Lagen.

Globaler Hersteller von Halbleitersubstraten. We use advanced Msap and Sap technology to manufacturing High multilayer interconnection package substrates.