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Organic Package Manufacturer. the Package Substrate will be made with BT, Rogers, Showa Denko and Ajinomoto High speed materials. We also offer Organic Package service.

Bio -Substrat FC BGA -Substrathersteller. High speed and high frequency material packaging substrate manufacturing.

Professional Embedded Cavity Substrate Manufacturer, we mainly produce Embedded Cavity PCB and Embedded Cavity Substrates. to use the BT base and rogers baes or other types High frequency and high speed substrate materials.

Hersteller von FCCSP-Flip-Chip-Gehäusesubstraten. Mit 100 µm können wir den kleinsten Bump-Pitch herstellen, Die besten kleinsten Leiterbahnen und Abstände sind 9 µm/9 µm. Benutze das Ajinomoto(ABF) Grundmaterial oder andere Arten von Hochfrequenz- und Hochgeschwindigkeits-Substratmaterialien.

Hersteller von BGA-Hohlraumsubstraten. We are professional Cavity PCB & Embedded components and parts substrates company. We can do the cavity slot with the Mixed dielectric layer.

Organic Packaging Manufacturer. We use advanced Msap and Sap technology to make the High multilayer interconnection package substrates from 4 Zu 20 Lagen. and our company also do the Organic Packaging service.