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Hersteller von BT FCCSP-Paketsubstraten. the Package Substrate will be made with BT base, Showa Denko and Ajinomoto High speed materials. or other types High speed and high frequency materials.

CSP package substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate firm.

Flip Chip CSP Package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing.Advanced technology and equipments.

Professional Wire Bond Substrate Manufacturer, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, ultra-small trace and led PCBs from 2 Schicht zu 20 Lagen.

Hersteller von Hohlraumsubstrat-Leiterplatten. High speed and high frequency material cavity packaging substrate and Cavity PCB boards manufacturing. Fortschrittliche Produktionstechnologie.

Chip-scale package and scale package substrates Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging service vendor.