Producător de substrat IC semiconductor
Producător de substrat IC semiconductor. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
Producător de substrat de pachete ceramice
Producător de substrat de pachete ceramice. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 la 18 straturi
Producător de pachete de substrat
Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
Producător de ambalaje de substrat
Producător de ambalaje de substrat. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 la 18 straturi,
Top 10 Producător de substrat de ambalare
Top 10 Producător de substrat de ambalare, we mainly produce ultra-small bump pitch substrate, ultra-small trace packaging substrate from 2~20L
Producător de substraturi de cipuri de ambalare organică
Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 strat la 20 straturi.
Tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com