News Archives - Seite 56 of 101 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 56

Rigid-flex packaging substrate manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Keramikverpackungssubstrathersteller. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Halbleiter -Substrathersteller. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Semiconductor packaging substrate manufacturer.High speed and high frequency material packaging substrate manufacturing.

We are a professional FCBGA Substrate supplier, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Trace und PCBs.

We are a professional Packaging substrate manufacturer, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Trace und PCBs.