News Archives - Seite 57 of 101 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 57

Ceramic package substrate. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Semiconductor substrate supplier. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Semiconductor FC BGA substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

We are a professional Semiconductor BGA substrate, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Trace- und Abstandspaket-Substrat und PCBs.

Rigid-Flex BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Rigid-Flex Packaging Substrate. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.