News Archives - Seite 59 of 100 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 59

Produce top-tier Flip Chip Packaging Substrate with 100um bump pitch, 9um trace, and 9um gap for optimal performance.

BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.

We are a professional FCBGA Packaging, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, ultra-small trace and PCBs.

We are a professional FCBGA package, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Spuren- und Abstandsverpackungssubstrat.

FCBGA package Substrate.High speed material packaging substrate manufacturing. Advanced packaging substrate production process.

Packaging Substrate. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 Zu 18 Lagen,