What is Package Substrate?
Package Substrate.High speed and high frequency material packaging substrate manufacturing. 첨단 패키징 기판 생산 공정.
What is Flip Chip Packaging Substrate?
Produce top-tier Flip Chip Packaging Substrate with 100um bump pitch, 9um trace, and 9um gap for optimal performance.
BGA 기판이란??
BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.
FCBGA 패키징 기술이란 무엇입니까??
We are a professional FCBGA Packaging, 초소형 범프 피치 기판을 주로 생산하고 있습니다., ultra-small trace and PCBs.
FCBGA 패키지란 무엇입니까??
We are a professional FCBGA package, 초소형 범프 피치 기판을 주로 생산하고 있습니다., ultra-small trace and spacing packaging substrate.
FCBGA 패키지 기판의 정의는 무엇입니까?
FCBGA package Substrate.High speed material packaging substrate manufacturing. 첨단 패키징 기판 생산 공정.
전화: +86 (0)755-8524-1496
이메일: info@alcantapcb.com