News Archives - 페이지 60 ~의 101 - 알칸타 기술(선전)주식회사 - 페이지 60

포장 기판. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 에게 18 레이어,

Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

우리는 기판패키지 기술개발 전문기업입니다., 초소형 범프 피치 기판을 주로 생산하고 있습니다., 초소형 트레이스 및 간격 패키징 기판 및 PCB.

We are a professional Substrate for semiconductor packaging, we mainly produce ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate cross section ic package, 초소형 범프 피치 기판을 주로 생산하고 있습니다., 초소형 트레이스 및 간격 패키징 기판 및 PCB. 현대 전자 분야에서는, packaging substrates are key components of electronic devices and play an important role in facilitating circuit connections, improving performance and…

We are a professional Semiconductor package substrates, we mainly produce ultra-small trace and spacing packaging substrate and PCBs. In the rapidly evolving landscape of the electronics industry, semiconductor packaging substrates have emerged as indispensable catalysts for technological advancement. This article aims to offer a comprehensive exploration of the fundamental concepts…