Was ist das Substrat des Flip -Chip -Pakets??
We are a professional flip chip package substrate, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Trace- und Abstandspaket-Substrat und PCBs. Flip -Chip -Verpackung, Eine modernste Technologie in der Welt der Elektrotechnik, hat die Art und Weise revolutioniert, wie Mikrochips und elektronische Komponenten verbunden und verpackt sind. In diesem Artikel,…
Sind die beiden häufigsten Materialien, die in einem IC -Paket verwendet werden?
Different types of ic packaging substrates manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. In the realm of modern electronic devices, the Integrated Circuit Package Substrate (IC package substrate) plays a pivotal role, serving as the crucial link between microchips and the…
What are the rules of packaging?
Design rules of substrate in packaging manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. In today's digital age, a new era of electronic devices and technology is evolving rapidly. One of the drivers of this advancement is packaging technology and substrate design…
Welche Anwendungen gibt es für Keramik in der Elektronik??
Ceramic substrates and packages.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. Keramik, often associated with fragility and artistic craftsmanship, actually occupy a pivotal place in the realm of electronics. Beyond their decorative aspects, ceramics serve as essential components in a diverse array…
Was ist der Unterschied zwischen BGA- und FBGA-Paketen??
Hersteller von BGA-Gehäusesubstratdesigns. Herstellung von Verpackungssubstraten aus Hochgeschwindigkeits- und Hochfrequenzmaterialien. Fortschrittlicher Produktionsprozess und Technologie für Verpackungssubstrate. In elektronischen Geräten, Kugelgitter-Array (BGA) und Fine-Pitch-Ball-Grid-Array (FBGA) Verpackungen sind zu zwei heißen Themen im Bereich der Verpackungstechnik geworden. BGA is a common packaging type,…
Antennenschild-Paketsubstrat
Unlocking the Power of Antenna Shield Package Substrates: Learn how this essential component enhances electronics, emphasizes innovation, and promotes sustainability. Dive into the future of electronic connectivity!
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