Diverse Application Fields of Packaging Substrate
We have made Quick-turn-circuit-boards. to produce the quick turn boards. we only need 1 oder 2 Tage. the PCB via holes are 0.15mm. line to line spacing is 0.08mm. pcb boards thick is 0.2mm to 3.0mm. pcb copper thick is 35um to 210um. about the pcb soldermask colour. we can…
FLIP -Chip -Paket -Substrathersteller
Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 Schicht zu 18 Lagen. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.
Was sind die fortschrittlichen Verpackungsprozesse??
Was ist das FC BGA -Paket? FC BGA -Paketreferenzhandbuch. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 Schicht zu 18 layer
Flip Chip -Paket -Substrat -Technologie
Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. Such as: 10 layer Flip-Chip Package Substrates. 12 layer. 14 layer. oder 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…
Ultra-Small Pitch Substrate
Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. So. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!
Advanced Package Substrate
Advanced Package Substrate manufacturer. We have used Msap and Sap technological process to produce the Package substrates with the Rogers Materials BT Materials, ABF Materials, and other types Materials. The range of main layers of our products is from 4 Schicht zu 18 Lagen. our company asways made the 10…
Tel: +86 (0)755-8524-1496
Email: info@alcantapcb.com