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We have made Quick-turn-circuit-boards. to produce the quick turn boards. we only need 1 oder 2 Tage. the PCB via holes are 0.15mm. line to line spacing is 0.08mm. pcb boards thick is 0.2mm to 3.0mm. pcb copper thick is 35um to 210um. about the pcb soldermask colour. we can…

Professional Flip-Chip Package Substrate Manufacturer. Wir bieten Flip-Chip-Verpackungssubstrat von an 4 Schicht zu 18 Lagen. Die kleinste Teilung beträgt 100 µm. Die kleinste Leiterbahn und der kleinste Abstand betragen 9 um/9 um.

Was ist das FC BGA -Paket? FC BGA -Paketreferenzhandbuch. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 Schicht zu 18 Schicht

Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. Wie zum Beispiel: 10 layer Flip-Chip Package Substrates. 12 Schicht. 14 Schicht. oder 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…

Hersteller von Ultra-Small-Pitch-Substraten. Herstellung von Leiterplatten mit extrem kleinen Abständen. The Substrate was made with advanced Msap or Sap technology. Also. Wir können 9-um-/9-um-Leiterbahn-/Abstandssubstrate oder Leiterplatten herstellen. Die Vorlaufzeit ist schnell. und stabile Qualität!

Advanced Package Substrate manufacturer. We have used Msap and Sap technological process to produce the Package substrates with the Rogers Materials BT Materials, ABF Materials, and other types Materials. The range of main layers of our products is from 4 Schicht zu 18 Lagen. our company asways made the 10…